A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
FLOOR CONSTRUCTION STRUCTURE OF BUILDING WITH EXCELLENT SOUND INSULATION EFFECT
The present invention relates to a floor construction structure of a building having an excellent sound insulation between floors, capable of improving excellent sound insulation between floors as well as having excellent heating efficiency with high thermal delivery performance, thermal insulation and the like by improving a patent application of Republic of Korea (No. 10-2015-0178009, Application Date: Dec 14, 2015) suggested by the present applicant. According to the present invention, the floor construction structure includes: a floor structure; a shock relieving unit installed on the floor structure; a support unit installed on the shock relieving unit; a heating panel installed on the support unit; and a heating pipe installed on the heating panel. The heating panel includes an insulation material installed on the support unit; and a thermal conductive panel installed on the insulation material. Here, an insertion hole is formed on the floor structure, and a lower side of the shock relieving unit is inserted into the insertion hole to be installed. According to the present invention, the floor construction structure is capable of having excellent sound insulation between floors and heating efficiency through improved sound insulation and heating structures.
본 발명은, 본 출원인이 제시한 대한민국 특허출원 제10-2015-0178009호(출원일 : 2015년 12월 14일)를 개량(개선)하여 층간 차음성 등이 향상되고 이와 함께 높은 열전달능과 단열성 등에 의해 우수한 난방 효율을 가지는 건축물의 바닥 시공구조에 관한 것이다. 본 발명은 바닥 구조체; 상기 바닥 구조체 상에 설치된 충격 완충 유닛; 상기 충격 완충 유닛 상에 설치된 지지 유닛; 상기 지지 유닛 상에 설치된 난방 패널; 및 상기 난방 패널에 설치된 난방 배관을 포함하고, 상기 난방 패널은 지지 유닛 상에 설치된 단열재와, 상기 단열재 상에 설치된 열전도성 패널을 포함한다. 이때, 상기 바닥 구조체에는 삽입홀이 형성되고, 상기 삽입홀에는 충격 완충 유닛의 하측이 삽입되어 설치된다. 본 발명에 따르면, 개선된 차음구조 및 난방구조에 의해 우수한 층간 차음성과 난방 효율 등을 갖는다.
FLOOR CONSTRUCTION STRUCTURE OF BUILDING WITH EXCELLENT SOUND INSULATION EFFECT
The present invention relates to a floor construction structure of a building having an excellent sound insulation between floors, capable of improving excellent sound insulation between floors as well as having excellent heating efficiency with high thermal delivery performance, thermal insulation and the like by improving a patent application of Republic of Korea (No. 10-2015-0178009, Application Date: Dec 14, 2015) suggested by the present applicant. According to the present invention, the floor construction structure includes: a floor structure; a shock relieving unit installed on the floor structure; a support unit installed on the shock relieving unit; a heating panel installed on the support unit; and a heating pipe installed on the heating panel. The heating panel includes an insulation material installed on the support unit; and a thermal conductive panel installed on the insulation material. Here, an insertion hole is formed on the floor structure, and a lower side of the shock relieving unit is inserted into the insertion hole to be installed. According to the present invention, the floor construction structure is capable of having excellent sound insulation between floors and heating efficiency through improved sound insulation and heating structures.
본 발명은, 본 출원인이 제시한 대한민국 특허출원 제10-2015-0178009호(출원일 : 2015년 12월 14일)를 개량(개선)하여 층간 차음성 등이 향상되고 이와 함께 높은 열전달능과 단열성 등에 의해 우수한 난방 효율을 가지는 건축물의 바닥 시공구조에 관한 것이다. 본 발명은 바닥 구조체; 상기 바닥 구조체 상에 설치된 충격 완충 유닛; 상기 충격 완충 유닛 상에 설치된 지지 유닛; 상기 지지 유닛 상에 설치된 난방 패널; 및 상기 난방 패널에 설치된 난방 배관을 포함하고, 상기 난방 패널은 지지 유닛 상에 설치된 단열재와, 상기 단열재 상에 설치된 열전도성 패널을 포함한다. 이때, 상기 바닥 구조체에는 삽입홀이 형성되고, 상기 삽입홀에는 충격 완충 유닛의 하측이 삽입되어 설치된다. 본 발명에 따르면, 개선된 차음구조 및 난방구조에 의해 우수한 층간 차음성과 난방 효율 등을 갖는다.
FLOOR CONSTRUCTION STRUCTURE OF BUILDING WITH EXCELLENT SOUND INSULATION EFFECT
우수한 층간 차음성을 가지는 건축물의 바닥 시공구조
AN SEUNG HAN (author)
2020-09-29
Patent
Electronic Resource
Korean
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