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Heat transfer pipe using heat conduction plate
The present invention relates to a heat transfer pipe for heating using a heat conduction plate, and more specifically, is arranged so that the heat conduction plate in which a plurality of through holes are continuously formed is brought into contact with an upper portion of the heat transfer pipe where a heating medium is stored. By doing so, heat is rapidly transmitted to the entire floor surface, and a time consumed until the interior is heated is drastically reduced, thereby reducing electricity consumption. In addition, not only warmth can be preserved for a long time but also electromagnetic waves generated in the heat transfer pipe can be cut off.
본 발명은 열전도판을 이용한 난방용 전열관에 관한 것으로서, 보다 상세하게는 다수의 통공이 연속적으로 형성되는 열전도판을 열매체가 저장되는 전열관의 상부에 접촉되게 배치시킴으로써, 바닥면 전체에 열을 신속하게 전달하여 실내가 난방될 때까지 소모되는 시간을 획기적으로 줄여 전기소모를 줄이며, 온기를 장기간 보존할 수 있도록 할 뿐만 아니라 전열관에서 발생하는 전자파를 차단할 수 있는 열전도판을 이용한 난방용 전열관에 관한 것이다.
Heat transfer pipe using heat conduction plate
The present invention relates to a heat transfer pipe for heating using a heat conduction plate, and more specifically, is arranged so that the heat conduction plate in which a plurality of through holes are continuously formed is brought into contact with an upper portion of the heat transfer pipe where a heating medium is stored. By doing so, heat is rapidly transmitted to the entire floor surface, and a time consumed until the interior is heated is drastically reduced, thereby reducing electricity consumption. In addition, not only warmth can be preserved for a long time but also electromagnetic waves generated in the heat transfer pipe can be cut off.
본 발명은 열전도판을 이용한 난방용 전열관에 관한 것으로서, 보다 상세하게는 다수의 통공이 연속적으로 형성되는 열전도판을 열매체가 저장되는 전열관의 상부에 접촉되게 배치시킴으로써, 바닥면 전체에 열을 신속하게 전달하여 실내가 난방될 때까지 소모되는 시간을 획기적으로 줄여 전기소모를 줄이며, 온기를 장기간 보존할 수 있도록 할 뿐만 아니라 전열관에서 발생하는 전자파를 차단할 수 있는 열전도판을 이용한 난방용 전열관에 관한 것이다.
Heat transfer pipe using heat conduction plate
열전도판을 이용한 난방용 전열관
LEE SANG HUN (author)
2018-04-27
Patent
Electronic Resource
Korean
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