A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
INSULATING SUBSTRATES INCLUDING THROUGH HOLES
도체용의 관통 구멍(2)이 배열되어 있는 절연 기판(1)을 제공한다. 절연 기판(1)의 두께가 25~300 ㎛이고, 관통 구멍(2)의 직경(W)이 20 ㎛~100 ㎛이고, 절연 기판(1)이 알루미나 소결체로 이루어진다. 알루미나 소결체의 상대 밀도가 99.5% 이상이며, 평균 입경이 2~50 ㎛이다.
It is provided an insulating substrate including through holes for conductors arranged in the insulating substrate. A thickness of the insulating substrate is 25 to 100 µ m, and a diameter of the through hole is 20 to 100 µ m. The insulating substrate includes a main body part and exposed regions exposed to the through holes and is composed an alumina sintered body. A relative density of the alumina sintered body is 99.5 percent or higher. The alumina sintered body has a purity of 99.9 percent or higher, and has an average grain size of 3 to 6 µ m in said main body part. Alumina grains are plate-shaped in the exposed region and the plate-shaped alumina grains have an average length of 8 to 25 µ m.
INSULATING SUBSTRATES INCLUDING THROUGH HOLES
도체용의 관통 구멍(2)이 배열되어 있는 절연 기판(1)을 제공한다. 절연 기판(1)의 두께가 25~300 ㎛이고, 관통 구멍(2)의 직경(W)이 20 ㎛~100 ㎛이고, 절연 기판(1)이 알루미나 소결체로 이루어진다. 알루미나 소결체의 상대 밀도가 99.5% 이상이며, 평균 입경이 2~50 ㎛이다.
It is provided an insulating substrate including through holes for conductors arranged in the insulating substrate. A thickness of the insulating substrate is 25 to 100 µ m, and a diameter of the through hole is 20 to 100 µ m. The insulating substrate includes a main body part and exposed regions exposed to the through holes and is composed an alumina sintered body. A relative density of the alumina sintered body is 99.5 percent or higher. The alumina sintered body has a purity of 99.9 percent or higher, and has an average grain size of 3 to 6 µ m in said main body part. Alumina grains are plate-shaped in the exposed region and the plate-shaped alumina grains have an average length of 8 to 25 µ m.
INSULATING SUBSTRATES INCLUDING THROUGH HOLES
관통 구멍을 갖는 절연 기판
2021-05-12
Patent
Electronic Resource
Korean