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    Capillary for Wire Bonding and Method for Manufacturing the Same

    New search for: LEE HYANG EI
    New search for: PARK SUNG KYUN
    New search for: HWANG SUNG WOOK

    The present invention relates to a capillary for wire bonding and a manufacturing method thereof and, more specifically, to a capillary for wire bonding with improved fracture toughness and wear resistance through the addition of graphene oxide and a manufacturing method thereof. The present invention provides a capillary for wire bonding made of a composite material containing 70 to 80 parts by weight of alumina, 20 to 30 parts by weight of zirconia, and 1 to 3 parts by weight of graphene oxide. The composite material has a polycrystalline structure. Bridged grain boundaries can be bridged by the graphene oxide.

    본 발명은 와이어 본딩용 캐필러리 및 그 제조방법에 관한 것으로, 더욱 상세하게는 그래핀 산화물 첨가를 통해 파괴 인성 및 내마모성을 향상시킨 와이어 본딩용 캐필러리 및 그 제조방법에 관한 것이다. 본 발명은, 알루미나 70 내지 80 중량부와, 지르코니아 20 내지 30 중량부와, 그래핀 산화물 1 내지 3 중량부를 포함하는 복합 재료로 이루어진 와이어 본딩용 캐필러리를 제공한다. 상기 복합 재료는 다결정 구조이며, 결정립 경계(Bridged Grain Boundaries)들은 상기 그래핀 산화물에 의해서 브릿지될 수 있다.

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    Capillary for Wire Bonding and Method for Manufacturing the Same

    New search for: LEE HYANG EI
    New search for: PARK SUNG KYUN
    New search for: HWANG SUNG WOOK

    The present invention relates to a capillary for wire bonding and a manufacturing method thereof and, more specifically, to a capillary for wire bonding with improved fracture toughness and wear resistance through the addition of graphene oxide and a manufacturing method thereof. The present invention provides a capillary for wire bonding made of a composite material containing 70 to 80 parts by weight of alumina, 20 to 30 parts by weight of zirconia, and 1 to 3 parts by weight of graphene oxide. The composite material has a polycrystalline structure. Bridged grain boundaries can be bridged by the graphene oxide.

    본 발명은 와이어 본딩용 캐필러리 및 그 제조방법에 관한 것으로, 더욱 상세하게는 그래핀 산화물 첨가를 통해 파괴 인성 및 내마모성을 향상시킨 와이어 본딩용 캐필러리 및 그 제조방법에 관한 것이다. 본 발명은, 알루미나 70 내지 80 중량부와, 지르코니아 20 내지 30 중량부와, 그래핀 산화물 1 내지 3 중량부를 포함하는 복합 재료로 이루어진 와이어 본딩용 캐필러리를 제공한다. 상기 복합 재료는 다결정 구조이며, 결정립 경계(Bridged Grain Boundaries)들은 상기 그래핀 산화물에 의해서 브릿지될 수 있다.

    Access

    Download

    Capillary for Wire Bonding and Method for Manufacturing the Same

    New search for: LEE HYANG EI
    New search for: PARK SUNG KYUN
    New search for: HWANG SUNG WOOK

    The present invention relates to a capillary for wire bonding and a manufacturing method thereof and, more specifically, to a capillary for wire bonding with improved fracture toughness and wear resistance through the addition of graphene oxide and a manufacturing method thereof. The present invention provides a capillary for wire bonding made of a composite material containing 70 to 80 parts by weight of alumina, 20 to 30 parts by weight of zirconia, and 1 to 3 parts by weight of graphene oxide. The composite material has a polycrystalline structure. Bridged grain boundaries can be bridged by the graphene oxide.

    본 발명은 와이어 본딩용 캐필러리 및 그 제조방법에 관한 것으로, 더욱 상세하게는 그래핀 산화물 첨가를 통해 파괴 인성 및 내마모성을 향상시킨 와이어 본딩용 캐필러리 및 그 제조방법에 관한 것이다. 본 발명은, 알루미나 70 내지 80 중량부와, 지르코니아 20 내지 30 중량부와, 그래핀 산화물 1 내지 3 중량부를 포함하는 복합 재료로 이루어진 와이어 본딩용 캐필러리를 제공한다. 상기 복합 재료는 다결정 구조이며, 결정립 경계(Bridged Grain Boundaries)들은 상기 그래핀 산화물에 의해서 브릿지될 수 있다.

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    Title:

    Capillary for Wire Bonding and Method for Manufacturing the Same

    Additional title:

    와이어 본딩용 캐필러리 및 그 제조방법

    Contributors:

    LEE HYANG EI (author) / PARK SUNG KYUN (author) / HWANG SUNG WOOK (author)

    Publication date:

    2023-08-31

    Type of media:

    Patent

    Type of material:

    Electronic Resource

    Language:

    Korean

    Classification:

    IPC:  H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / B29C Formen oder Verbinden von Kunststoffen , SHAPING OR JOINING OF PLASTICS / C04B Kalk , LIME

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