A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
WAVELENGTH CONVERSION BONDING MEMBER WAVELENGTH CONVERSION HEAT DISSIPATION MEMBER AND LIGHT-EMITTING DEVICE
파장 변환 접합 부재는, 형광체 세라믹스 소자와, 형광체 세라믹스 소자의 일방면에 마련되는 접합층을 구비하고, 접합층의 열전도율이 0.20W/m·K를 초과하며, 접합층의 반사율이 90% 이상이다.
A wavelength conversion bonding member includes a phosphor ceramic element and a bonding layer provided on one side of the phosphor ceramic element, wherein the bonding layer has a thermal conductivity of more than 0.20 W/m·K, and the bonding layer has a reflectivity of 90% or more.
WAVELENGTH CONVERSION BONDING MEMBER WAVELENGTH CONVERSION HEAT DISSIPATION MEMBER AND LIGHT-EMITTING DEVICE
파장 변환 접합 부재는, 형광체 세라믹스 소자와, 형광체 세라믹스 소자의 일방면에 마련되는 접합층을 구비하고, 접합층의 열전도율이 0.20W/m·K를 초과하며, 접합층의 반사율이 90% 이상이다.
A wavelength conversion bonding member includes a phosphor ceramic element and a bonding layer provided on one side of the phosphor ceramic element, wherein the bonding layer has a thermal conductivity of more than 0.20 W/m·K, and the bonding layer has a reflectivity of 90% or more.
WAVELENGTH CONVERSION BONDING MEMBER WAVELENGTH CONVERSION HEAT DISSIPATION MEMBER AND LIGHT-EMITTING DEVICE
파장 변환 접합 부재, 파장 변환 방열 부재 및 발광 장치
FUJII HIRONAKA (author) / SHIRAKAWA MASAHIRO (author)
2016-12-21
Patent
Electronic Resource
Korean
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