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WAVELENGTH CONVERSION BONDING MEMBER, WAVELENGTH CONVERSION HEAT DISSIPATION MEMBER, AND LIGHT-EMITTING DEVICE
A wavelength conversion bonding member includes a phosphor ceramic element and a bonding layer provided on one side of the phosphor ceramic element, wherein the bonding layer has a thermal conductivity of more than 0.20 W/m·K, and the bonding layer has a reflectivity of 90% or more.
WAVELENGTH CONVERSION BONDING MEMBER, WAVELENGTH CONVERSION HEAT DISSIPATION MEMBER, AND LIGHT-EMITTING DEVICE
A wavelength conversion bonding member includes a phosphor ceramic element and a bonding layer provided on one side of the phosphor ceramic element, wherein the bonding layer has a thermal conductivity of more than 0.20 W/m·K, and the bonding layer has a reflectivity of 90% or more.
WAVELENGTH CONVERSION BONDING MEMBER, WAVELENGTH CONVERSION HEAT DISSIPATION MEMBER, AND LIGHT-EMITTING DEVICE
FUJII HIRONAKA (author) / SHIRAKAWA MASAHIRO (author)
2017-02-09
Patent
Electronic Resource
English
IPC:
H01L
Halbleiterbauelemente
,
SEMICONDUCTOR DEVICES
/
C04B
Kalk
,
LIME
/
C08K
Verwendung von anorganischen oder nichtmakromolekularen organischen Stoffen als Zusatzstoffe
,
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
/
C09D
Überzugsmittel, z.B. Anstrichstoffe, Firnisse oder Lacke
,
COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS
/
C09K
Materialien für Anwendungen, soweit nicht anderweitig vorgesehen
,
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR
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