SOUND PROOF MATERIAL BETWEEN FLOORS OF MULTISTORY BUILDINGS: Fid-Bau Portal

SOUND PROOF MATERIAL BETWEEN FLOORS OF MULTISTORY BUILDINGS

HEO HO BUM

본 발명은 제1 흡음층; 및 상기 제1 흡음층 상에 적층된 제2 흡음층을 포함하고, 제1흡음층 및 제2 흡음층은 내부에 기공이 형성된 열가소성 수지를 포함하며, 상기 기공의 직경은 0.05 내지 1.5mm인 층간방음재에 관한 것이다. 본 발명의 층간방음재는 방음효과 및 내습성이 우수하며, 재활용 소재의 도입이 가능하므로 경제성 및 친환경성이 우수하다.

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SOUND PROOF MATERIAL BETWEEN FLOORS OF MULTISTORY BUILDINGS

HEO HO BUM

Abstract

SOUND PROOF MATERIAL BETWEEN FLOORS OF MULTISTORY BUILDINGS

HEO HO BUM

Abstract

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Title:

SOUND PROOF MATERIAL BETWEEN FLOORS OF MULTISTORY BUILDINGS

Additional title:

층간방음재

Contributors:

HEO HO BUM (author)

Publication date:

2017-10-19

Type of media:

Patent

Type of material:

Electronic Resource

Language:

Korean

Classification:

IPC: E04F FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS , Ausbau von Bauwerken, z.B. Treppen, Fußböden / E04B Allgemeine Baukonstruktionen , GENERAL BUILDING CONSTRUCTIONS / E04C STRUCTURAL ELEMENTS , Bauelemente

Thabet, W. Y. / Beliveau, Y. J. | British Library Online Contents | 1994

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