A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
EPS EXPANDED POLYSTYRENE CUSHIONING MATERIAL USING AIR SPACE FOR REDUCING NOISES BETWEEN FLOORS
According to the present invention, an expanded polystyrene cushioning material comprises: a first cushioning member provided with a contact unit adhering to a floor surface of a slab of a building and a plurality of stepped portions placed at an upper side from the contact unit to maintain a distance between the slab and the stepped portions for a space provided with an air layer to be provided; and a second cushioning member laminated on the first cushioning member to support a flooring material.
본 발명은, 건축물의 슬래브 바닥면에 밀착되는 밀착부와, 상기 밀착부로부터 상측에 위치하여 상기 슬래브와 간격을 유지하며 공기층이 구비되는 공간을 제공하는 복수 개의 단차부를 구비하는 제1완충부재; 및 상기 제1완충부재에 적층되고 바닥재를 지지하는 제2완충부재를 포함하는 것을 특징으로 한다.
EPS EXPANDED POLYSTYRENE CUSHIONING MATERIAL USING AIR SPACE FOR REDUCING NOISES BETWEEN FLOORS
According to the present invention, an expanded polystyrene cushioning material comprises: a first cushioning member provided with a contact unit adhering to a floor surface of a slab of a building and a plurality of stepped portions placed at an upper side from the contact unit to maintain a distance between the slab and the stepped portions for a space provided with an air layer to be provided; and a second cushioning member laminated on the first cushioning member to support a flooring material.
본 발명은, 건축물의 슬래브 바닥면에 밀착되는 밀착부와, 상기 밀착부로부터 상측에 위치하여 상기 슬래브와 간격을 유지하며 공기층이 구비되는 공간을 제공하는 복수 개의 단차부를 구비하는 제1완충부재; 및 상기 제1완충부재에 적층되고 바닥재를 지지하는 제2완충부재를 포함하는 것을 특징으로 한다.
EPS EXPANDED POLYSTYRENE CUSHIONING MATERIAL USING AIR SPACE FOR REDUCING NOISES BETWEEN FLOORS
층간소음 저감용 공기층을 활용한 EPS완충재 및 이의 시공방법
SONG MOO KEUN (author) / HAN DONG YOUL (author) / WEE JOON RANG (author) / AN IL SUP (author) / SONG YEONG JU (author)
2019-02-11
Patent
Electronic Resource
Korean
CUSHIONING MATERIAL FOR REDUCING NOISE BETWEEN FLOORS AND MANUFACTURING DEVICE THEREOF
European Patent Office | 2024