A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
INSULATION BOARD AND MANUFACTURING METHOD THEREOF
The present invention relates to an insulation board with improved insulating properties and a manufacturing method thereof and, more specifically, to an insulation board with improved insulating properties and a manufacturing method thereof, wherein the insulation board with the improved insulating properties is configured to have a core formed by being surrounded with a skin after paper is compressed in a foam manufactured by using a foam-molding method. Thus, the insulation board with the improved insulating properties can further improve flame retardant and insulating properties compared to an existing insulation board and increase composability between the core and the foam foam-molded through the skin to be stably molded.
본 발명은 단열성을 향상시킨 단열보드 및 이의 제조방법에 관한 것으로서, 보다 상세하게는 발포성형 방식을 이용하여 제조되는 발포폼 내부에 종이를 압착시킨 후 스킨으로 감싸서 성형한 심재를 구비하도록 이루어짐에 따라 종래의 단열보드보다 난연성, 단열성을 보다 향상시키고, 스킨을 통해 발포성형되는 폼과 심재의 결합성을 높여 안정적으로 성형될 수 있는 단열성을 향상시킨 단열보드 및 이의 제조방법에 관한 것이다.
INSULATION BOARD AND MANUFACTURING METHOD THEREOF
The present invention relates to an insulation board with improved insulating properties and a manufacturing method thereof and, more specifically, to an insulation board with improved insulating properties and a manufacturing method thereof, wherein the insulation board with the improved insulating properties is configured to have a core formed by being surrounded with a skin after paper is compressed in a foam manufactured by using a foam-molding method. Thus, the insulation board with the improved insulating properties can further improve flame retardant and insulating properties compared to an existing insulation board and increase composability between the core and the foam foam-molded through the skin to be stably molded.
본 발명은 단열성을 향상시킨 단열보드 및 이의 제조방법에 관한 것으로서, 보다 상세하게는 발포성형 방식을 이용하여 제조되는 발포폼 내부에 종이를 압착시킨 후 스킨으로 감싸서 성형한 심재를 구비하도록 이루어짐에 따라 종래의 단열보드보다 난연성, 단열성을 보다 향상시키고, 스킨을 통해 발포성형되는 폼과 심재의 결합성을 높여 안정적으로 성형될 수 있는 단열성을 향상시킨 단열보드 및 이의 제조방법에 관한 것이다.
INSULATION BOARD AND MANUFACTURING METHOD THEREOF
단열성을 향상시킨 단열보드 및 이의 제조방법
KIM SOO HYUN (author)
2021-01-27
Patent
Electronic Resource
Korean
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