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Heat dissipation material for electronic devices using germanium
The present invention remarkably improves the heat dissipation effect by mixing germanium ionized water and an appropriate amount of fine germanium powder (GeO_2 or germanium ingot (clump) powder) in a ceramic liquid solution, and coating the mixture on a heat reduction film of an electronic device that requires a heat dissipation function.
본 발명은 게르마늄이온수와 미세한 게르마늄 분말(GeO2 또는 게르마늄 인고트(덩어리)분말)적당량을 세라믹 액상 용액에 믹싱하여, 방열 기능이 필요한 전자기기의 열감소 필름에 코팅함으로써 방열 효과를 획기적으로 개선한다.
Heat dissipation material for electronic devices using germanium
The present invention remarkably improves the heat dissipation effect by mixing germanium ionized water and an appropriate amount of fine germanium powder (GeO_2 or germanium ingot (clump) powder) in a ceramic liquid solution, and coating the mixture on a heat reduction film of an electronic device that requires a heat dissipation function.
본 발명은 게르마늄이온수와 미세한 게르마늄 분말(GeO2 또는 게르마늄 인고트(덩어리)분말)적당량을 세라믹 액상 용액에 믹싱하여, 방열 기능이 필요한 전자기기의 열감소 필름에 코팅함으로써 방열 효과를 획기적으로 개선한다.
Heat dissipation material for electronic devices using germanium
게르마늄 성분을 이용한 전자기기용 방열 소재
LEE YONG WOO (author) / JUNG MI RA (author)
2021-03-30
Patent
Electronic Resource
Korean
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