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Method for improved semiconductor processing equipment tool pedestal/pad vibration isolation and reduction
A method to improve vibration isolation in semiconductor process level inhibits vibration frequencies transmitted though building structure from production tools, pumps, compressors, chillers, AHUs (Air Handling Units), and footfalls traffic on raised floor system on to tool pedestals and pads from affecting semiconductor fabrication processes. The tool pedestal/pad for modern semiconductor FABs are required have very small tolerance to ambient vibration. Therefore, reduction and isolation of vibration of tool pedestal/pad is the key requirement for safe, reliable and uninterrupted operation of modern semiconductor FABs. Sound proofing material and foam is injected into hollow steel and/or aluminum support members and sound proofing adhesives and/or caulking are applied at points of connections in conjunction with mechanical fastening. In various applications, placement of shaped wielded rod utilized for dissipating vibration energy in center of hollow member which is surrounded with sound proofing material and/or foam.
Method for improved semiconductor processing equipment tool pedestal/pad vibration isolation and reduction
A method to improve vibration isolation in semiconductor process level inhibits vibration frequencies transmitted though building structure from production tools, pumps, compressors, chillers, AHUs (Air Handling Units), and footfalls traffic on raised floor system on to tool pedestals and pads from affecting semiconductor fabrication processes. The tool pedestal/pad for modern semiconductor FABs are required have very small tolerance to ambient vibration. Therefore, reduction and isolation of vibration of tool pedestal/pad is the key requirement for safe, reliable and uninterrupted operation of modern semiconductor FABs. Sound proofing material and foam is injected into hollow steel and/or aluminum support members and sound proofing adhesives and/or caulking are applied at points of connections in conjunction with mechanical fastening. In various applications, placement of shaped wielded rod utilized for dissipating vibration energy in center of hollow member which is surrounded with sound proofing material and/or foam.
Method for improved semiconductor processing equipment tool pedestal/pad vibration isolation and reduction
KIM-WHITTY SUK K (author)
2018-08-28
Patent
Electronic Resource
English
IPC:
F16F
SPRINGS
,
Federn
/
E04B
Allgemeine Baukonstruktionen
,
GENERAL BUILDING CONSTRUCTIONS
/
E04C
STRUCTURAL ELEMENTS
,
Bauelemente
/
E04F
FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
,
Ausbau von Bauwerken, z.B. Treppen, Fußböden
/
F16M
Rahmen, Gehäuse oder Grundplatten von Kraftmaschinen oder anderen Maschinen oder von Apparaten, nicht auf eine besondere Art von Maschine oder Apparat eingeschränkt, die anderweitig vorgesehen ist
,
FRAMES, CASINGS, OR BEDS, OF ENGINES OR OTHER MACHINES OR APPARATUS, NOT SPECIFIC TO AN ENGINE, MACHINE, OR APPARATUS PROVIDED FOR ELSEWHERE
/
H01L
Halbleiterbauelemente
,
SEMICONDUCTOR DEVICES
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