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Method and system for improved semiconductor processing equipment vibration isolation and reduction
A method to improve vibration isolation in semiconductor process level inhibits vibration frequencies transmitted though building structure from production tools, pumps, compressors, chillers, AHUs (Air Handling Units), and footfalls traffic on raised floor system on to tool pedestals and pads from affecting semiconductor fabrication processes. Sound proofing material and foam is injected into hollow steel and/or aluminum support members and sound proofing adhesives and/or caulking are applied at points of connections in conjunction with mechanical fastening. In various applications, placement of shaped wielded rod utilized for dissipating vibration energy in center of hollow member which is surrounded with sound proofing material and/or foam. In addition, utilization of this method for dedicated MEP (mechanical, electrical, plumbing) support pedestal, only attach as support for MEP lines, as to improve isolation of low frequency vibration.
Method and system for improved semiconductor processing equipment vibration isolation and reduction
A method to improve vibration isolation in semiconductor process level inhibits vibration frequencies transmitted though building structure from production tools, pumps, compressors, chillers, AHUs (Air Handling Units), and footfalls traffic on raised floor system on to tool pedestals and pads from affecting semiconductor fabrication processes. Sound proofing material and foam is injected into hollow steel and/or aluminum support members and sound proofing adhesives and/or caulking are applied at points of connections in conjunction with mechanical fastening. In various applications, placement of shaped wielded rod utilized for dissipating vibration energy in center of hollow member which is surrounded with sound proofing material and/or foam. In addition, utilization of this method for dedicated MEP (mechanical, electrical, plumbing) support pedestal, only attach as support for MEP lines, as to improve isolation of low frequency vibration.
Method and system for improved semiconductor processing equipment vibration isolation and reduction
KIM-WHITTY SUK K (author)
2018-06-12
Patent
Electronic Resource
English
IPC:
F16F
SPRINGS
,
Federn
/
E04C
STRUCTURAL ELEMENTS
,
Bauelemente
/
E04F
FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
,
Ausbau von Bauwerken, z.B. Treppen, Fußböden
/
F16M
Rahmen, Gehäuse oder Grundplatten von Kraftmaschinen oder anderen Maschinen oder von Apparaten, nicht auf eine besondere Art von Maschine oder Apparat eingeschränkt, die anderweitig vorgesehen ist
,
FRAMES, CASINGS, OR BEDS, OF ENGINES OR OTHER MACHINES OR APPARATUS, NOT SPECIFIC TO AN ENGINE, MACHINE, OR APPARATUS PROVIDED FOR ELSEWHERE
European Patent Office | 2019
|European Patent Office | 2019
|European Patent Office | 2018
|European Patent Office | 2018
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