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Method for producing ceramic-aluminum bonded body, method for producing power module substrate, ceramic-aluminum bonded body, and power module substrate
A method for producing a ceramic-aluminum bonded body obtained by bonding a ceramic member and an aluminum member, the aluminum member before bonding being composed of aluminum having a purity of 99.0 mass % or higher and 99.9 mass % or lower, includes a heat treatment step of subjecting the aluminum member to a heat treatment in a range of 400° C. or higher and lower than a solidus temperature, and a bonding step of bonding the aluminum member after the heat treatment step and the ceramic member via a brazing filler material including Si.
Method for producing ceramic-aluminum bonded body, method for producing power module substrate, ceramic-aluminum bonded body, and power module substrate
A method for producing a ceramic-aluminum bonded body obtained by bonding a ceramic member and an aluminum member, the aluminum member before bonding being composed of aluminum having a purity of 99.0 mass % or higher and 99.9 mass % or lower, includes a heat treatment step of subjecting the aluminum member to a heat treatment in a range of 400° C. or higher and lower than a solidus temperature, and a bonding step of bonding the aluminum member after the heat treatment step and the ceramic member via a brazing filler material including Si.
Method for producing ceramic-aluminum bonded body, method for producing power module substrate, ceramic-aluminum bonded body, and power module substrate
IWAZAKI WATARU (author) / ISHIDUKA HIROYA (author)
2020-02-25
Patent
Electronic Resource
English
IPC:
C04B
Kalk
,
LIME
/
B32B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
,
Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse
/
H01L
Halbleiterbauelemente
,
SEMICONDUCTOR DEVICES
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