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Composite sintered body, semiconductor manufacturing apparatus member, and method of manufacturing composite sintered body
A method of manufacturing a composite sintered body includes a step (Step S11) of molding mixed powder in which Al2O3, SiC, and MgO are mixed, into a green body having a predetermined shape and a step (Step S12) of generating a composite sintered body by sintering the green body. Then, in Step S11, the ratio of SiC to the mixed powder is not lower than 4.0 weight percentage and not higher than 13.0 weight percentage. Further, the purity of Al2O3 in Step S11 is not lower than 99.9%. It is thereby possible to suppress the abnormal grain growth of Al2O3 and suitably manufacture a composite sintered body having high relative dielectric constant and withstand voltage, and low tan δ.
Composite sintered body, semiconductor manufacturing apparatus member, and method of manufacturing composite sintered body
A method of manufacturing a composite sintered body includes a step (Step S11) of molding mixed powder in which Al2O3, SiC, and MgO are mixed, into a green body having a predetermined shape and a step (Step S12) of generating a composite sintered body by sintering the green body. Then, in Step S11, the ratio of SiC to the mixed powder is not lower than 4.0 weight percentage and not higher than 13.0 weight percentage. Further, the purity of Al2O3 in Step S11 is not lower than 99.9%. It is thereby possible to suppress the abnormal grain growth of Al2O3 and suitably manufacture a composite sintered body having high relative dielectric constant and withstand voltage, and low tan δ.
Composite sintered body, semiconductor manufacturing apparatus member, and method of manufacturing composite sintered body
NAGAI ASUMI (author) / INOUE KATSUHIRO (author) / KATSUDA YUJI (author)
2023-12-05
Patent
Electronic Resource
English
IPC:
H01T
SPARK GAPS
,
Funkenstrecken
/
B28B
Formgeben von Ton oder anderen keramischen Stoffzusammensetzungen, Schlacke oder von Mischungen, die zementartiges Material enthalten, z.B. Putzmörtel
,
SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS, SLAG OR MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
/
C04B
Kalk
,
LIME
/
H01L
Halbleiterbauelemente
,
SEMICONDUCTOR DEVICES
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