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SINTER MOLD MATERIAL, SINTERING AND MOLDING METHOD, SINTER MOLD OBJECT, AND SINTERING AND MOLDING APPARATUS
A sintering and molding method includes forming a fluid mold material by heating a sinter mold material, which includes inorganic particles, a binder material and a binder material which bond together the inorganic particles, to a temperature equal to or more than the melting points of the binder materials, forming a mold layer by spreading the fluid mold material, layering a mold layer, applying UV ink to a desired region on the mold layer, forming a mold cross sectional pattern by curing the UV ink which is applied to a desired region on the mold layer, finishing a mold object by removing a region, where the UV ink is not applied, in the mold layer, carrying out heat treatment on the mold object at a temperature which is less than the initial temperature of thermal decomposition of the binder material, and carrying out sintering treatment on the mold object.
SINTER MOLD MATERIAL, SINTERING AND MOLDING METHOD, SINTER MOLD OBJECT, AND SINTERING AND MOLDING APPARATUS
A sintering and molding method includes forming a fluid mold material by heating a sinter mold material, which includes inorganic particles, a binder material and a binder material which bond together the inorganic particles, to a temperature equal to or more than the melting points of the binder materials, forming a mold layer by spreading the fluid mold material, layering a mold layer, applying UV ink to a desired region on the mold layer, forming a mold cross sectional pattern by curing the UV ink which is applied to a desired region on the mold layer, finishing a mold object by removing a region, where the UV ink is not applied, in the mold layer, carrying out heat treatment on the mold object at a temperature which is less than the initial temperature of thermal decomposition of the binder material, and carrying out sintering treatment on the mold object.
SINTER MOLD MATERIAL, SINTERING AND MOLDING METHOD, SINTER MOLD OBJECT, AND SINTERING AND MOLDING APPARATUS
HIRATA KOKI (author)
2015-08-13
Patent
Electronic Resource
English
IPC:
B22F
Verarbeiten von Metallpulver
,
WORKING METALLIC POWDER
/
B28B
Formgeben von Ton oder anderen keramischen Stoffzusammensetzungen, Schlacke oder von Mischungen, die zementartiges Material enthalten, z.B. Putzmörtel
,
SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS, SLAG OR MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
/
C04B
Kalk
,
LIME
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