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CONDUCTIVE PASTE AND CERAMIC SUBSTRATE MANUFACTURED USING THE SAME
[Problem to be solved] The present invention provides a conductive paste for constrained firing and a ceramic substrate manufactured with the conductive paste, the conductive paste having an excellent plating resistance and a good adherence against a ceramic substrate and a plated film even after plating treatment, wherein a constraining layer after firing can be easily removed without remaining on a surface conductor in a case where co-firing is performed. [Solution] Provided is a conductive paste comprising 60 to 95 mass % of an Ag powder as the content in a paste composition, 0.5 to 5 mass % of a borosilicate based glass powder relative to the Ag powder, the remainder being a platinum group metal additive and an organic vehicle, wherein the platinum group metal additive contains at least two metals of Ru and Rh, and the content of Ru and the content of Rh in the platinum group metal additive are 0.05 to 5 mass % of Ru and 0.001 to 0.1 mass % of Rh respectively in terms of metal components relative to the mass of the Ag powder
CONDUCTIVE PASTE AND CERAMIC SUBSTRATE MANUFACTURED USING THE SAME
[Problem to be solved] The present invention provides a conductive paste for constrained firing and a ceramic substrate manufactured with the conductive paste, the conductive paste having an excellent plating resistance and a good adherence against a ceramic substrate and a plated film even after plating treatment, wherein a constraining layer after firing can be easily removed without remaining on a surface conductor in a case where co-firing is performed. [Solution] Provided is a conductive paste comprising 60 to 95 mass % of an Ag powder as the content in a paste composition, 0.5 to 5 mass % of a borosilicate based glass powder relative to the Ag powder, the remainder being a platinum group metal additive and an organic vehicle, wherein the platinum group metal additive contains at least two metals of Ru and Rh, and the content of Ru and the content of Rh in the platinum group metal additive are 0.05 to 5 mass % of Ru and 0.001 to 0.1 mass % of Rh respectively in terms of metal components relative to the mass of the Ag powder
CONDUCTIVE PASTE AND CERAMIC SUBSTRATE MANUFACTURED USING THE SAME
SATO MINORU (author) / KAWATA TOMOAKI (author) / HIRANO MASAHIRO (author) / ONOZUMI SHIGEKAZU (author)
2015-10-01
Patent
Electronic Resource
English
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