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NOVEL ADHESION PROMOTING AGENTS FOR METALLISATION OF SUBSTRATE SURFACES
A method is provided for metallisation of non-conductive substrates providing a high adhesion of the deposited metal to the substrate material and thereby forming a durable bond. The method applies a novel combination of a metal oxide compound to promote adhesion and a transition metal plating catalyst compound promoting the metal layer formation.
NOVEL ADHESION PROMOTING AGENTS FOR METALLISATION OF SUBSTRATE SURFACES
A method is provided for metallisation of non-conductive substrates providing a high adhesion of the deposited metal to the substrate material and thereby forming a durable bond. The method applies a novel combination of a metal oxide compound to promote adhesion and a transition metal plating catalyst compound promoting the metal layer formation.
NOVEL ADHESION PROMOTING AGENTS FOR METALLISATION OF SUBSTRATE SURFACES
LIU ZHIMING (author) / FU HAILUO (author) / HUNEGNAW SARA (author) / BRANDT LUTZ (author) / MAGAYA TAFADZWA (author)
2016-08-18
Patent
Electronic Resource
English
IPC:
C23C
Beschichten metallischer Werkstoffe
,
COATING METALLIC MATERIAL
/
C03C
Chemische Zusammensetzungen für Gläser, Glasuren oder Emails
,
CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUS ENAMELS
/
C04B
Kalk
,
LIME
/
C25D
Verfahren für die elektrolytische oder elektrophoretische Herstellung von Überzügen
,
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS
/
H01L
Halbleiterbauelemente
,
SEMICONDUCTOR DEVICES
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