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WATER-HOLDING STRUCTURE BONDING KIT
A bonding kit for use with a water-holding structure, the kit having a bonding conductor with a body portion configured to reside within a component attached to the water-holding structure. The bonding conductor includes an extension portion configured to extend outwardly from the component. The bonding kit includes a conductor fitting configured to attach to the extension portion of the bonding conductor and to attach to a conductive system of the water-holding structure, providing an electrical connection between the bonding conductor, or water therein, and the conductive system, the bonding conductor providing equipotential bonding for water contained in the water-holding structure.
WATER-HOLDING STRUCTURE BONDING KIT
A bonding kit for use with a water-holding structure, the kit having a bonding conductor with a body portion configured to reside within a component attached to the water-holding structure. The bonding conductor includes an extension portion configured to extend outwardly from the component. The bonding kit includes a conductor fitting configured to attach to the extension portion of the bonding conductor and to attach to a conductive system of the water-holding structure, providing an electrical connection between the bonding conductor, or water therein, and the conductive system, the bonding conductor providing equipotential bonding for water contained in the water-holding structure.
WATER-HOLDING STRUCTURE BONDING KIT
VOGTNER ZACHARY T (author)
2017-02-02
Patent
Electronic Resource
English
European Patent Office | 2021
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