A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Articles having Diamond-only Contact Surfaces
Diamond-containing articles such as composite materials shaped as some specific article, can be engineered such that bodies that contact the article only contact diamond. In an embodiment, the article may be in the form of equipment for handling semiconductor wafers such as vacuum or electrostatic chucks. In one embodiment, the diamond-containing article can be a composite of diamond particulate reinforcing a Si/SiC body such as reaction-bonded SiC. Lapping the diamond-reinforced RBSC body with progressively finer diamond grit removes some of the SiC/Si matrix material, leaving diamond particles of uniform height “standing proud” above the rest of the surface of the formed article. Further, if the diamond-containing article is sufficiently electrically conductive, it may be machinable using electrical discharge machining.
Articles having Diamond-only Contact Surfaces
Diamond-containing articles such as composite materials shaped as some specific article, can be engineered such that bodies that contact the article only contact diamond. In an embodiment, the article may be in the form of equipment for handling semiconductor wafers such as vacuum or electrostatic chucks. In one embodiment, the diamond-containing article can be a composite of diamond particulate reinforcing a Si/SiC body such as reaction-bonded SiC. Lapping the diamond-reinforced RBSC body with progressively finer diamond grit removes some of the SiC/Si matrix material, leaving diamond particles of uniform height “standing proud” above the rest of the surface of the formed article. Further, if the diamond-containing article is sufficiently electrically conductive, it may be machinable using electrical discharge machining.
Articles having Diamond-only Contact Surfaces
MASTROBATTISTO DANIEL (author) / GRATRIX EDWARD (author) / KARANDIKAR PRASHANT (author) / VANCE WILLIAM (author)
2018-04-12
Patent
Electronic Resource
English
IPC:
B24D
TOOLS FOR GRINDING, BUFFING OR SHARPENING
,
Werkzeuge zum Schleifen, Polieren oder Schärfen
/
B24B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
,
Maschinen, Einrichtungen oder Verfahren zum Schleifen oder Polieren
/
C04B
Kalk
,
LIME
/
C30B
SINGLE-CRYSTAL GROWTH
,
Züchten von Einkristallen
/
H01L
Halbleiterbauelemente
,
SEMICONDUCTOR DEVICES