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The present invention relates to a method for laying tiles (2) on a laying substrate, in which, initially, tile adhesive (8) is applied to the laying substrate and the tiles (2) are subsequently laid in the tile adhesive (8), characterized in that, before applying the tile adhesive (8) to the laying surface, leveling strips (5) of the same height are affixed so that the top faces of the leveling strips (5) lie in a common reference plane, and in that the tile adhesive (8) is applied between the leveling strips (5) with some protrusion which is then, using a screeding board (9) guided along the top faces of the leveling strips (5), removed down to the level of the reference plane, generating a flat tile adhesive layer (11).
The present invention relates to a method for laying tiles (2) on a laying substrate, in which, initially, tile adhesive (8) is applied to the laying substrate and the tiles (2) are subsequently laid in the tile adhesive (8), characterized in that, before applying the tile adhesive (8) to the laying surface, leveling strips (5) of the same height are affixed so that the top faces of the leveling strips (5) lie in a common reference plane, and in that the tile adhesive (8) is applied between the leveling strips (5) with some protrusion which is then, using a screeding board (9) guided along the top faces of the leveling strips (5), removed down to the level of the reference plane, generating a flat tile adhesive layer (11).
METHOD FOR LAYING TILES
SCHLÜTER WERNER (author)
2018-05-17
Patent
Electronic Resource
English
IPC:
E04F
FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
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Ausbau von Bauwerken, z.B. Treppen, Fußböden
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