A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
COPPER/CERAMIC JOINED BODY, INSULATED CIRCUIT BOARD, METHOD FOR PRODUCING COPPER/CERAMIC JOINED BODY, AND METHOD FOR PRODUCING INSULATED CIRCUIT BOARD
There is provided a copper/ceramic bonded body of the present invention in which a copper member made of copper or a copper alloy and a ceramic member made of aluminum nitride or silicon nitride are bonded to each other, in which an active metal nitride layer containing a nitride of one or more active metals selected from Ti, Zr, Nb, and Hf is formed on the ceramic member side between the copper member and the ceramic member, a Mg solid solution layer in which Mg is dissolved in a Cu matrix phase is formed between the active metal nitride layer and the copper member, and the active metal is present in the Mg solid solution layer.
COPPER/CERAMIC JOINED BODY, INSULATED CIRCUIT BOARD, METHOD FOR PRODUCING COPPER/CERAMIC JOINED BODY, AND METHOD FOR PRODUCING INSULATED CIRCUIT BOARD
There is provided a copper/ceramic bonded body of the present invention in which a copper member made of copper or a copper alloy and a ceramic member made of aluminum nitride or silicon nitride are bonded to each other, in which an active metal nitride layer containing a nitride of one or more active metals selected from Ti, Zr, Nb, and Hf is formed on the ceramic member side between the copper member and the ceramic member, a Mg solid solution layer in which Mg is dissolved in a Cu matrix phase is formed between the active metal nitride layer and the copper member, and the active metal is present in the Mg solid solution layer.
COPPER/CERAMIC JOINED BODY, INSULATED CIRCUIT BOARD, METHOD FOR PRODUCING COPPER/CERAMIC JOINED BODY, AND METHOD FOR PRODUCING INSULATED CIRCUIT BOARD
TERASAKI NOBUYUKI (author)
2020-01-02
Patent
Electronic Resource
English
| European Patent Office | 2018
| European Patent Office | 2021
| European Patent Office | 2020