Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    BONDED BODY, CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING BONDED BODY

    New search for: SUENAGA SEIICHI
    New search for: YONETSU MAKI
    New search for: FUJISAWA SACHIKO

    A bonded body according to an embodiment comprises a ceramic substrate, a copper plate, and a bonding layer provided on at least one surface of the ceramic substrate and bonding the ceramic substrate and the copper plate, in which the bonding layer contains Ag, Cu, Ti, and a first element being one or two selected from Sn and In, a Ti alloy of Ti and at least one selected from Ag, Cu, Sn, and In existing at a bonding boundary between the copper plate and the bonding layer, and the Ti alloy existing over not less than 30% per a length of 30 μm at the bonding boundary.

    Access

    Download

    Access

    Download

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    BONDED BODY, CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING BONDED BODY

    New search for: SUENAGA SEIICHI
    New search for: YONETSU MAKI
    New search for: FUJISAWA SACHIKO

    A bonded body according to an embodiment comprises a ceramic substrate, a copper plate, and a bonding layer provided on at least one surface of the ceramic substrate and bonding the ceramic substrate and the copper plate, in which the bonding layer contains Ag, Cu, Ti, and a first element being one or two selected from Sn and In, a Ti alloy of Ti and at least one selected from Ag, Cu, Sn, and In existing at a bonding boundary between the copper plate and the bonding layer, and the Ti alloy existing over not less than 30% per a length of 30 μm at the bonding boundary.

    Access

    Download

    BONDED BODY, CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING BONDED BODY

    New search for: SUENAGA SEIICHI
    New search for: YONETSU MAKI
    New search for: FUJISAWA SACHIKO

    A bonded body according to an embodiment comprises a ceramic substrate, a copper plate, and a bonding layer provided on at least one surface of the ceramic substrate and bonding the ceramic substrate and the copper plate, in which the bonding layer contains Ag, Cu, Ti, and a first element being one or two selected from Sn and In, a Ti alloy of Ti and at least one selected from Ag, Cu, Sn, and In existing at a bonding boundary between the copper plate and the bonding layer, and the Ti alloy existing over not less than 30% per a length of 30 μm at the bonding boundary.

    Access

    Download

    Access

    Download

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    BONDED BODY, CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING BONDED BODY

    Contributors:

    SUENAGA SEIICHI (author) / YONETSU MAKI (author) / FUJISAWA SACHIKO (author)

    Publication date:

    2023-05-04

    Type of media:

    Patent

    Type of material:

    Electronic Resource

    Language:

    English

    Classification:

    IPC:  H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / C04B Kalk , LIME / H05K PRINTED CIRCUITS , Gedruckte Schaltungen

    Similar titles

    BONDED BODY, CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING BONDED BODY

    SUENAGA SEIICHI / YONETSU MAKI / FUJISAWA SACHIKO | European Patent Office | 2023

    Free access

    BONDED BODY, CERAMIC CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING BONDED BODY

    FUJISAWA SACHIKO / SUENAGA SEIICHI / MORI YOICHIRO | European Patent Office | 2024

    Free access

    Circuit board, bonded body, and method for manufacturing circuit board and bonded body

    YUASA AKIMASA / NAKAMURA TAKAHIRO / EJIMA YOSHIYUKI et al. | European Patent Office | 2022

    Free access

    Bonded body, circuit board, and semiconductor device

    YONETSU MAKI / SUENAGA SEIICHI / FUJISAWA SACHIKO et al. | European Patent Office | 2024

    Free access

    BONDED BODY, CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE

    YONETSU MAKI / SUENAGA SEIICHI / FUJISAWA SACHIKO et al. | European Patent Office | 2021

    Free access
    Back to top