A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
CERAMIC WAFER WITH SURFACE SHAPE AND MANUFACTURING THEREOF
The present invention provides a ceramic wafer with a surface shape and a manufacturing method thereof. The ceramic wafer has an upper surface and a lower surface, and at least one of the upper surface and the lower surface has an irregular surface shape. The total thickness variation (TTV) value between the two surfaces ranges from 0.1 to 100 μm. The ceramic wafer with the surface shape of the present invention, by controlling the total thickness variation of the wafer, not only helps the coating, but also improves the flow of the fluid, and can improve the bonding force of the coating and reduce the surface defects in the subsequent process.
CERAMIC WAFER WITH SURFACE SHAPE AND MANUFACTURING THEREOF
The present invention provides a ceramic wafer with a surface shape and a manufacturing method thereof. The ceramic wafer has an upper surface and a lower surface, and at least one of the upper surface and the lower surface has an irregular surface shape. The total thickness variation (TTV) value between the two surfaces ranges from 0.1 to 100 μm. The ceramic wafer with the surface shape of the present invention, by controlling the total thickness variation of the wafer, not only helps the coating, but also improves the flow of the fluid, and can improve the bonding force of the coating and reduce the surface defects in the subsequent process.
CERAMIC WAFER WITH SURFACE SHAPE AND MANUFACTURING THEREOF
ZENG YAN-KAI (author) / JIANG BAI-XUAN (author) / JIANG RUI-FENG (author)
2024-02-22
Patent
Electronic Resource
English
CERAMIC WAFER WITH SURFACE SHAPE AND MANUFACTURING THEREOF
| European Patent Office | 2024
Ceramic wafer with surface shape and manufacturing method thereof
| European Patent Office | 2024