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An adhesive floor/wallboard includes a floor/wallboard main body layer and a buffer layer adhered to the back surface of the floor/wallboard main body layer. The buffer layer is provided with a plurality of holes. The holes extend through the buffer layer to the main body layer. Glue is deposited in the holes. The buffer layer is adhered to the back surface of the floor/wallboard. The glue in the holes makes direct contact with the floor/wallboard main body at the holes. Due to the holes and their depth, the contact area between the glue, the buffer layer and the main body is increased. Accordingly, the adhesive floor/wallboard can be more firmly adhered to a backing surface.
An adhesive floor/wallboard includes a floor/wallboard main body layer and a buffer layer adhered to the back surface of the floor/wallboard main body layer. The buffer layer is provided with a plurality of holes. The holes extend through the buffer layer to the main body layer. Glue is deposited in the holes. The buffer layer is adhered to the back surface of the floor/wallboard. The glue in the holes makes direct contact with the floor/wallboard main body at the holes. Due to the holes and their depth, the contact area between the glue, the buffer layer and the main body is increased. Accordingly, the adhesive floor/wallboard can be more firmly adhered to a backing surface.
Adhesive Floor/Wallboard and Method of Using Same
CHEN ZHU (author)
2024-09-19
Patent
Electronic Resource
English
IPC:
E04F
FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
,
Ausbau von Bauwerken, z.B. Treppen, Fußböden
/
B32B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
,
Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse
Wallboard or floor and method for producing wallboard or floor
European Patent Office | 2023
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