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Electronic component element housing package
An electronic component element housing package is produced by firing a ceramic substrate for housing an electronic component element and a metal layer for bonding to the ceramic substrate to form an electrical path, simultaneously in a reducing atmosphere. The ceramic substrate comprises alumina (Al2O3), a partially stabilized zirconia by forming solid solution with yttria (Y2O3) and a sintering agent. The sintering agent comprises magnesia (MgO), and at least 1 type selected from silica (SiO2), calcia (CaO), or manganese oxides (MnO, MnO2, Mn2O3, Mn3O4).
Electronic component element housing package
An electronic component element housing package is produced by firing a ceramic substrate for housing an electronic component element and a metal layer for bonding to the ceramic substrate to form an electrical path, simultaneously in a reducing atmosphere. The ceramic substrate comprises alumina (Al2O3), a partially stabilized zirconia by forming solid solution with yttria (Y2O3) and a sintering agent. The sintering agent comprises magnesia (MgO), and at least 1 type selected from silica (SiO2), calcia (CaO), or manganese oxides (MnO, MnO2, Mn2O3, Mn3O4).
Electronic component element housing package
NAGAHIRO MASANORI (author)
2015-08-25
Patent
Electronic Resource
English
IPC:
B32B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
,
Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse
/
B22F
Verarbeiten von Metallpulver
,
WORKING METALLIC POWDER
/
C04B
Kalk
,
LIME
/
C22C
Legierungen
,
ALLOYS
/
H01L
Halbleiterbauelemente
,
SEMICONDUCTOR DEVICES
/
H05K
PRINTED CIRCUITS
,
Gedruckte Schaltungen
Preliminary Housing Element; Component 15-1
NTIS | 1970
NTIS | 1971
Lukewarm response to government housing package
British Library Online Contents | 2008