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Ceramic filler, method of preparing the ceramic filler and applications as resonator and laminate thereof
The present disclosure relates to ceramic fillers and methods for preparing said ceramic fillers. The present disclosure further relates to dielectric resonator, fluoropolymer-ceramic filler compositions and their corresponding laminates along with their respective methods for preparing the same from the ceramic fillers. The present disclosure further provides a dielectric resonator and fluoropolymer-ceramic filler laminates having enhanced dielectric properties. The present disclosure also relates to various microwave applications of such fillers, resonators and laminates including microwave devices and circuits.
Ceramic filler, method of preparing the ceramic filler and applications as resonator and laminate thereof
The present disclosure relates to ceramic fillers and methods for preparing said ceramic fillers. The present disclosure further relates to dielectric resonator, fluoropolymer-ceramic filler compositions and their corresponding laminates along with their respective methods for preparing the same from the ceramic fillers. The present disclosure further provides a dielectric resonator and fluoropolymer-ceramic filler laminates having enhanced dielectric properties. The present disclosure also relates to various microwave applications of such fillers, resonators and laminates including microwave devices and circuits.
Ceramic filler, method of preparing the ceramic filler and applications as resonator and laminate thereof
RAVENDRAN RATHEESH (author) / KOLLANNOOR STANLEY JACOB (author) / MURALI KODAKATTUMANA PURUSHOTHAMAN (author) / JAIN AKHILESH (author) / HANNURKAR PUNDLIK RAMA (author)
2016-11-29
Patent
Electronic Resource
English
IPC:
C08K
Verwendung von anorganischen oder nichtmakromolekularen organischen Stoffen als Zusatzstoffe
,
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
/
C01G
Verbindungen der von den Unterklassen C01D oder C01F nicht umfassten Metalle
,
COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
/
C04B
Kalk
,
LIME
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