A platform for research: civil engineering, architecture and urbanism
Method for making a biocompatible hermetic housing including hermetic electrical feedthroughs
A method for fabricating a biocompatible hermetic housing including electrical feedthroughs, the method comprises providing a ceramic sheet having an upper surface and a lower surface, forming at least one via hole in said ceramic sheet extending from said upper surface to said lower surface, inserting a conductive thick film paste into said via hole, laminating the ceramic sheet with paste filled via hole between an upper ceramic sheet and a lower ceramic sheet to form a laminated ceramic substrate, firing the laminated ceramic substrate to a temperature to sinter the laminated ceramic substrate and cause the paste filled via hole to form metalized via and cause the laminated ceramic substrate to form a hermetic seal around said metalized via, and removing the upper ceramic sheet and the lower ceramic sheet material from the fired laminated ceramic substrate to expose an upper and a lower surface of the metalized via.
Method for making a biocompatible hermetic housing including hermetic electrical feedthroughs
A method for fabricating a biocompatible hermetic housing including electrical feedthroughs, the method comprises providing a ceramic sheet having an upper surface and a lower surface, forming at least one via hole in said ceramic sheet extending from said upper surface to said lower surface, inserting a conductive thick film paste into said via hole, laminating the ceramic sheet with paste filled via hole between an upper ceramic sheet and a lower ceramic sheet to form a laminated ceramic substrate, firing the laminated ceramic substrate to a temperature to sinter the laminated ceramic substrate and cause the paste filled via hole to form metalized via and cause the laminated ceramic substrate to form a hermetic seal around said metalized via, and removing the upper ceramic sheet and the lower ceramic sheet material from the fired laminated ceramic substrate to expose an upper and a lower surface of the metalized via.
Method for making a biocompatible hermetic housing including hermetic electrical feedthroughs
OK JERRY (author) / GREENBERG ROBERT J (author)
2017-07-25
Patent
Electronic Resource
English
IPC:
C03B
Herstellung oder Formgebung von Glas, Mineral- oder Schlackenwolle
,
MANUFACTURE OR SHAPING OF GLASS, OR OF MINERAL OR SLAG WOOL
/
B29C
Formen oder Verbinden von Kunststoffen
,
SHAPING OR JOINING OF PLASTICS
/
B32B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
,
Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse
/
C04B
Kalk
,
LIME
/
H05K
PRINTED CIRCUITS
,
Gedruckte Schaltungen
Method for making a biocompatible hermetic housing including hermetic electrical feedthroughs
European Patent Office | 2018
|The hermetic housing frame and hermetic cover coupled thereto
European Patent Office | 2024
The hermetic housing frame and hermetic cover coupled thereto
European Patent Office | 2023
|METHOD FOR PRODUCING HERMETIC PACKAGE, AND HERMETIC PACKAGE
European Patent Office | 2019
|