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Analysis of Thermally Loaded Laminated Circular Plates
The investigation is concerned with the formulation of a method to determine stress levels in laminated plate systems, when subjected to thermal and/or mechanical loadings, for use in simulation of a highway pavement system. The physical parameters which affect the stress are listed. Parametric investigations are carried out to determine the influence of the individual parameters on the temperature-induced stress levels in one-, two-, and three-layered pavement systems. In addition, the formulation is modified to include in the study the simultaneous application of mechanical (wheel and subbase) and thermal loadings. Results are obtained for the thermally loaded three-layered system with and without mechanical loadings to determine when and how much vehicular traffic increases the stress levels in the pavement present due to a temperature gradient.
Analysis of Thermally Loaded Laminated Circular Plates
The investigation is concerned with the formulation of a method to determine stress levels in laminated plate systems, when subjected to thermal and/or mechanical loadings, for use in simulation of a highway pavement system. The physical parameters which affect the stress are listed. Parametric investigations are carried out to determine the influence of the individual parameters on the temperature-induced stress levels in one-, two-, and three-layered pavement systems. In addition, the formulation is modified to include in the study the simultaneous application of mechanical (wheel and subbase) and thermal loadings. Results are obtained for the thermally loaded three-layered system with and without mechanical loadings to determine when and how much vehicular traffic increases the stress levels in the pavement present due to a temperature gradient.
Analysis of Thermally Loaded Laminated Circular Plates
J. F. Carney (author)
1973
77 pages
Report
No indication
English
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