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TECHNICAL PAPERS - Microstructural Modeling for Elastic Moduli of Bonded Granules

Chang, Ching S.

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TECHNICAL PAPERS - Microstructural Modeling for Elastic Moduli of Bonded Granules

Chang, Ching S.

TECHNICAL PAPERS - Microstructural Modeling for Elastic Moduli of Bonded Granules

Chang, Ching S.

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Title:

TECHNICAL PAPERS - Microstructural Modeling for Elastic Moduli of Bonded Granules

Contributors:

Chang, Ching S. (author) / Shi, Qing S. / Zhu, Han

Published in:

Journal of engineering mechanics ; 125

Publication date:

1999

ISSN:

0733-9399

Type of media:

Article (Journal)

Type of material:

Language:

English

Keywords:

Zeitschrift , Technische Mechanik

Classification:

Local classification TIB: 770/3300
BKL: 56.11 / 50.31 / 50.31 Technische Mechanik / 56.11 Baukonstruktion

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