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    Thermal performance of an aluminum honeycomb wallboard incorporating microencapsulated PCM

    New search for: Lai, Chi-ming
    New search for: Hokoi, Shuichi

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    Thermal performance of an aluminum honeycomb wallboard incorporating microencapsulated PCM

    New search for: Lai, Chi-ming
    New search for: Hokoi, Shuichi

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Thermal performance of an aluminum honeycomb wallboard incorporating microencapsulated PCM

    New search for: Lai, Chi-ming
    New search for: Hokoi, Shuichi

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Thermal performance of an aluminum honeycomb wallboard incorporating microencapsulated PCM

    Contributors:

    Lai, Chi-ming (author) / Hokoi, Shuichi

    Published in:

    Energy and buildings ; 73

    Publication date:

    2014

    ISSN:

    0378-7788

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    Unknown

    Keywords:

    Zeitschrift , Bauphysik

    Classification:

    BKL:  52.42 / 52.42 Heizungstechnik, Lüftungstechnik, Klimatechnik / 56.50 Technischer Ausbau / 56.55 Bauphysik, Bautenschutz / 56.55 / 56.65 / 56.00 / 56.65 Bauökologie, Baubiologie / 56.50
    Local classification TIB:  645/6520/6605

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