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The Process Transfer of Oxygen Reactive Ion Etching of Polyimide between Different Etch Equipments

Hydes, A. J. / Cox, T. I. / Hope, D. A. O. / Deshmukh, V. G. I.

Abstract The aim of this work is to determine if a dry etch process,as characterised by its etch performance, could be transferred between equipments of very different geometries,by a physical characterisation and the proper transfer of these parameters. The process selected was the etching of polyimide in an O2 plasma being an example of a simple system,yet one that has important technological application as part of the tri-level resist scheme1. The anisotropy of etched features was used to assess the success of the process transfer.

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The Process Transfer of Oxygen Reactive Ion Etching of Polyimide between Different Etch Equipments

Hydes, A. J. / Cox, T. I. / Hope, D. A. O. / Deshmukh, V. G. I.

Abstract The aim of this work is to determine if a dry etch process,as characterised by its etch performance, could be transferred between equipments of very different geometries,by a physical characterisation and the proper transfer of these parameters. The process selected was the etching of polyimide in an O2 plasma being an example of a simple system,yet one that has important technological application as part of the tri-level resist scheme1. The anisotropy of etched features was used to assess the success of the process transfer.

The Process Transfer of Oxygen Reactive Ion Etching of Polyimide between Different Etch Equipments

Hydes, A. J. / Cox, T. I. / Hope, D. A. O. / Deshmukh, V. G. I.

Abstract The aim of this work is to determine if a dry etch process,as characterised by its etch performance, could be transferred between equipments of very different geometries,by a physical characterisation and the proper transfer of these parameters. The process selected was the etching of polyimide in an O2 plasma being an example of a simple system,yet one that has important technological application as part of the tri-level resist scheme1. The anisotropy of etched features was used to assess the success of the process transfer.

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Title:

The Process Transfer of Oxygen Reactive Ion Etching of Polyimide between Different Etch Equipments

Contributors:

Hydes, A. J. (author) / Cox, T. I. (author) / Hope, D. A. O. (author) / Deshmukh, V. G. I. (author)

Published in:

Plasma-Surface Interactions and Processing of Materials ; 499-501

NATO ASI Series ; 176

Publication date:

1990-01-01

Size:

3 pages

ISBN:

978-94-009-1946-4 , 978-94-010-7369-1

ISSN:

DOI:

https://doi.org/10.1007/978-94-009-1946-4_32

Type of media:

Article/Chapter (Book)

Type of material:

Electronic Resource

Language:

English

Keywords:

Etch Rate , Langmuir Probe , Electron Energy Distribution Function , Plasma Potential , Etched Feature Chemistry , Industrial Chemistry/Chemical Engineering , Characterization and Evaluation of Materials , Nuclear Physics, Heavy Ions, Hadrons , Physical Chemistry

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