A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Cold curing epoxy adhesives for building applications
Polymers open access to many new production techniques. This also applies for the building industry. CFRPstraps bonded with special cold curing adhesives have become an important technique for the supplementary reinforcement of buildings. For the successful application the specific material behaviour, especially of the adhesive, has to be considered. Thermal application limits were investigated with a method based on DMA-curves. They suggest that often stated values close to the glass transitions temperature for such adhesives should be reconsidered. Defining the glass transition temperature as application limit is not reasonable, as the softening of the material already starts at lower temperatures. It appears to be realistic to determine application limits according to DIN 65583. Furthermore it needs to be considered, that this limit will move towards lower temperatures with increased loading levels. Finally bonding takes place under building site conditions, so that even lower degrees of cross-linking and thus lower application limits must be expected than the ones derived under laboratory conditions and stated in this paper.
Cold curing epoxy adhesives for building applications
Polymers open access to many new production techniques. This also applies for the building industry. CFRPstraps bonded with special cold curing adhesives have become an important technique for the supplementary reinforcement of buildings. For the successful application the specific material behaviour, especially of the adhesive, has to be considered. Thermal application limits were investigated with a method based on DMA-curves. They suggest that often stated values close to the glass transitions temperature for such adhesives should be reconsidered. Defining the glass transition temperature as application limit is not reasonable, as the softening of the material already starts at lower temperatures. It appears to be realistic to determine application limits according to DIN 65583. Furthermore it needs to be considered, that this limit will move towards lower temperatures with increased loading levels. Finally bonding takes place under building site conditions, so that even lower degrees of cross-linking and thus lower application limits must be expected than the ones derived under laboratory conditions and stated in this paper.
Cold curing epoxy adhesives for building applications
Kalt härtende Epoxidharz-Klebstoffe für bautechnische Anwendungen
Hülder, G. (author) / Ehrenstein, G.W. (author)
2006
5 Seiten, 8 Bilder, 4 Quellen
Conference paper
English
Zweikomponentenklebstoff , Aushärten (Polymer) , Klebverbindung , Epoxidharz , Anwendungsgebiet , Bautechnik , thermomechanische Eigenschaft , Belastungsgrenze , Erweichungsbereich , Temperaturabhängigkeit , Glasumwandlungstemperatur , Ankleben , carbonfaserverstärkter Kunststoff , thermomechanische Analyse
Mechanical performance of cold-curing epoxy adhesives after different mixing and curing procedures
| British Library Online Contents | 2016
Mechanical performance of cold-curing epoxy adhesives after different mixing and curing procedures
| British Library Online Contents | 2016
Determination of curing for transparent epoxy resin adhesives
| Tema Archive | 2011
Curing behavior of epoxy-adhesives for bonded CFRP reinforcements
| British Library Conference Proceedings | 2008