A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Determination of curing for transparent epoxy resin adhesives
Transparent epoxy resin adhesives are interesting for load-bearing joints in the fields of facade technology and glass construction. Until now, there was a lack of knowledge about the influence of ambient conditions on the curing process of these adhesives. Thus, we present the results of an experimental study performed on two-component, cold-cured and on single-component, cationically cured epoxy resin systems. The analysis refers to the influence of the reaction temperature respectively of the light source on the curing speed, the thermo-mechanical properties and optical characteristics of these adhesives. This paper presents a selection of results of various analysis methods to evaluate these effects. These comprise calorimetric, thermomechanical and spectroscopic methods.
Determination of curing for transparent epoxy resin adhesives
Transparent epoxy resin adhesives are interesting for load-bearing joints in the fields of facade technology and glass construction. Until now, there was a lack of knowledge about the influence of ambient conditions on the curing process of these adhesives. Thus, we present the results of an experimental study performed on two-component, cold-cured and on single-component, cationically cured epoxy resin systems. The analysis refers to the influence of the reaction temperature respectively of the light source on the curing speed, the thermo-mechanical properties and optical characteristics of these adhesives. This paper presents a selection of results of various analysis methods to evaluate these effects. These comprise calorimetric, thermomechanical and spectroscopic methods.
Determination of curing for transparent epoxy resin adhesives
Weller, Bernhard (author) / Kothe, Christiane (author) / Wünsch, Jan (author)
2011
6 Seiten, 11 Bilder, 1 Tabelle, 14 Quellen
Conference paper
English
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