Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Grain boundary creep in copper
Grain boundary creep in copper
Grain boundary creep in copper
Ayensu, A. (Autor:in) / Quainoo, G. K. (Autor:in) / Adjepong, S. K. (Autor:in)
JOURNAL OF MATERIALS SCIENCE LETTERS ; 12 ; 1008
01.01.1993
1008 pages
Aufsatz (Zeitschrift)
Unbekannt
DDC:
620.11
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