Electron tomography of microelectronic device interconnects

Yang, Q. / Mardinly, J. / Kubel, C. et al. | British Library Online Contents | 2006

Grain structure effect on electromigration reliability of Cu interconnects with CoWP capping

Zhang, L. / Ho, P.S. / Aubel, O. et al. | British Library Online Contents | 2011

Texture Investigations In Damascene Copper Interconnects

Mirpuri, K. / Szpunar, J. A. / Kozaczek, K. | British Library Online Contents | 2002

Modeling of the effects of crystallographic orientation on electromigration-limited reliability of interconnects with bamboo grain structures

Fayad, W. R. / Andleigh, V. K. / Thompson, C. V. | British Library Online Contents | 2001

Scaling effects on microstructure and reliability for Cu interconnects

Ho, P.S. / Zschech, E. / Schmeisser, D. et al. | British Library Online Contents | 2010