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Texture and Grain Structure Effects on the Reliability of Microelectronic Interconnects

Knorr, D. B. / Rodbell, K. P.

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Texture and Grain Structure Effects on the Reliability of Microelectronic Interconnects

Knorr, D. B. / Rodbell, K. P.

Texture and Grain Structure Effects on the Reliability of Microelectronic Interconnects

Knorr, D. B. / Rodbell, K. P.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Texture and Grain Structure Effects on the Reliability of Microelectronic Interconnects

Contributors:

Knorr, D. B. (author) / Rodbell, K. P. (author)

Published in:

MATERIALS SCIENCE FORUM ; 1435

Publication date:

1994-01-01

Size:

1435 pages

ISSN:

0255-5476

Type of media:

Article (Journal)

Type of material:

Language:

Unknown

Classification:

DDC: 620.11

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