Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Plated leadframe metrology
Reilly, F. C. (Autor:in)
ADVANCED PACKAGING ; 11 ; 25-26
01.01.2002
2 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
658.564
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Leadframe Chip Scale Packaging
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Failure paths of the Cu-based leadframe/EMC joints
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Hardness of bi-layer films on a leadframe substrate
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Whisker Initiation Behavior from Electrodeposited Sn/Cu Coating on Cu Leadframe
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Failure paths at copper-base leadframe/epoxy molding compound interfaces
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