Effect of solder bump geometry on the microstructure of Sn-3.5 wt% Ag on electroless nickel immersion gold during solder dipping

Huang, Z. / Conway, P. P. / Liu, C. et al. | British Library Online Contents | 2005

Microstructure and Thermal Stability of Electrodeposited Nanocrystalline Nickel

Abraham, M. / Holdway, P. / Cerezo, A. et al. | British Library Online Contents | 2002

Superplasticity and Microstructure Evolution of Electrodeposited Nanocrystalline Nickel

Ding, S. / Zhang, K. F. / Wang, G. F. | British Library Online Contents | 2007

Microstructure and growth of electrodeposited nanocrystalline nickel foils

Cziraki, A. / Fogarassy, B. / Geroecs, I. et al. | British Library Online Contents | 1994

Microstructure and Mechanical Properties of Electrodeposited Thin Nickel Films

Kostin, M. O. / Sheikina, O. H. | British Library Online Contents | 2002