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    The composition and microstructure of electrodeposited solder on electroless nickel in the presence of gelatine

    New search for: Lin, K.-L.
    New search for: Chang, J.-T.

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    The composition and microstructure of electrodeposited solder on electroless nickel in the presence of gelatine

    New search for: Lin, K.-L.
    New search for: Chang, J.-T.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    The composition and microstructure of electrodeposited solder on electroless nickel in the presence of gelatine

    New search for: Lin, K.-L.
    New search for: Chang, J.-T.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
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    Document information
    Similar titles

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    Document information
    Title:

    The composition and microstructure of electrodeposited solder on electroless nickel in the presence of gelatine

    Contributors:

    Lin, K.-L. (author) / Chang, J.-T. (author)

    Published in:

    JOURNAL OF MATERIALS SCIENCE ; 30 ; 1879

    Publication date:

    1995-01-01

    Size:

    1879 pages

    ISSN:

    0022-2461

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    Unknown

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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