Effect of solder bump geometry on the microstructure of Sn-3.5 wt% Ag on electroless nickel immersion gold during solder dipping: Fid-Bau Portal

Effect of solder bump geometry on the microstructure of Sn-3.5 wt% Ag on electroless nickel immersion gold during solder dipping

Huang, Z. / Conway, P. P. / Liu, C. / Thomson, R. C.

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Effect of solder bump geometry on the microstructure of Sn-3.5 wt% Ag on electroless nickel immersion gold during solder dipping

Huang, Z. / Conway, P. P. / Liu, C. / Thomson, R. C.

Effect of solder bump geometry on the microstructure of Sn-3.5 wt% Ag on electroless nickel immersion gold during solder dipping

Huang, Z. / Conway, P. P. / Liu, C. / Thomson, R. C.

Zugriff

Zugriff über TIB

Verfügbarkeit in meiner Bibliothek prüfen

Bestellung bei Subito €

Seitennavigation

Dokumentinformationen

Ähnliche Titel

Exportieren, teilen und zitieren

Dokumentinformationen

Titel:

Effect of solder bump geometry on the microstructure of Sn-3.5 wt% Ag on electroless nickel immersion gold during solder dipping

Beteiligte:

Huang, Z. (Autor:in) / Conway, P. P. (Autor:in) / Liu, C. (Autor:in) / Thomson, R. C. (Autor:in)

Erschienen in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 20 ; 649-658

Erscheinungsdatum:

01.01.2005

Format / Umfang:

10 pages

ISSN:

0884-2914

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.11

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