Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
The effects of temperature and humidity on phenol-formaldehyde resin bonding
The effects of temperature and humidity on phenol-formaldehyde resin bonding
The effects of temperature and humidity on phenol-formaldehyde resin bonding
Wang, X.-M. (Autor:in) / Riedl, B. (Autor:in) / Christiansen, A. W. (Autor:in) / Geimer, R. L. (Autor:in)
WOOD SCIENCE AND TECHNOLOGY -NEW YORK- ; 29 ; 253
01.01.1995
253 pages
Aufsatz (Zeitschrift)
Unbekannt
DDC:
620.12
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