A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
The effects of temperature and humidity on phenol-formaldehyde resin bonding
The effects of temperature and humidity on phenol-formaldehyde resin bonding
The effects of temperature and humidity on phenol-formaldehyde resin bonding
Wang, X.-M. (author) / Riedl, B. (author) / Christiansen, A. W. (author) / Geimer, R. L. (author)
WOOD SCIENCE AND TECHNOLOGY -NEW YORK- ; 29 ; 253
1995-01-01
253 pages
Article (Journal)
Unknown
DDC:
620.12
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Phenol-formaldehyde resin curing and bonding under dynamic conditions
| British Library Online Contents | 1996
Bonding surface activated hardwood flakeboard with phenol-formaldehyde resin
| Tema Archive | 1991
Development of Phenol-Formaldehyde-Starch Resin
| British Library Online Contents | 2000
| Springer Verlag | 1990
Effects of irradiation on nano-pore phenol-formaldehyde resin infiltrated IG-110 graphite
| DOAJ | 2022