Role of microstructure on surface and subsurface damage of sintered silicon carbide during grinding and polishing

Gao, J. / Chen, J. / Liu, G. et al. | British Library Online Contents | 2010

Subsurface damage mechanism of high speed grinding process in single crystal silicon revealed by atomistic simulations

Li, J. / Fang, Q. / Zhang, L. et al. | British Library Online Contents | 2015

Subsurface damage in polishing–annealing processed ZnO substrates

Prozheeva, V. / Johansen, K.M. / Neuvonen, P.T. et al. | British Library Online Contents | 2017

Subsurface damage in polishing–annealing processed ZnO substrates

Prozheeva, V. / Johansen, K.M. / Neuvonen, P.T. et al. | British Library Online Contents | 2017

Investigation of Subsurface Damage Depth of Single Crystal Silicon in Electroplated Wire Saw Slicing

Gao, Y.F. / Ge, P.Q. / Li, S.J. | British Library Online Contents | 2009