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Deposition of titanium nitride/tungsten layers for application in vertically integrated circuits technology
Deposition of titanium nitride/tungsten layers for application in vertically integrated circuits technology
Deposition of titanium nitride/tungsten layers for application in vertically integrated circuits technology
Ruhl, G. (Autor:in) / Froeschle, B. (Autor:in) / Ramm, P. (Autor:in) / Intemann, A. (Autor:in) / Pamler, W. (Autor:in) / Gessner, T. / Schulz, S. E.
01.01.1996
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621.35
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