A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Deposition of titanium nitride/tungsten layers for application in vertically integrated circuits technology
Deposition of titanium nitride/tungsten layers for application in vertically integrated circuits technology
Deposition of titanium nitride/tungsten layers for application in vertically integrated circuits technology
Ruhl, G. (author) / Froeschle, B. (author) / Ramm, P. (author) / Intemann, A. (author) / Pamler, W. (author) / Gessner, T. / Schulz, S. E.
1996-01-01
6 pages
Article (Journal)
English
DDC:
621.35
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Fabrication, characterization, and mechanism of vertically aligned titanium nitride nanowires
| British Library Online Contents | 2012
Application and manufacturing technology of tungsten and tungsten-titanium targets
| British Library Online Contents | 2009
Deposition of titanium nitride layers by electric arc - Reactive plasma spraying method
| British Library Online Contents | 2013
Low Temperature Deposition of Titanium Nitride
| British Library Online Contents | 1998
CVD Synthesis of Tungsten Nitride and Its Deposition Behavior
| British Library Online Contents | 2007