Detection of junction failures and other defects in silicon and III-V devices using the LBIC technique in lateral configuration: Fid-Bau Portal

Detection of junction failures and other defects in silicon and III-V devices using the LBIC technique in lateral configuration

Acciarri, M. / Binetti, S. / Garavaglia, M. / Pizzini, S.

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Detection of junction failures and other defects in silicon and III-V devices using the LBIC technique in lateral configuration

Acciarri, M. / Binetti, S. / Garavaglia, M. / Pizzini, S.

Detection of junction failures and other defects in silicon and III-V devices using the LBIC technique in lateral configuration

Acciarri, M. / Binetti, S. / Garavaglia, M. / Pizzini, S.

Zugriff

Zugriff über TIB

Verfügbarkeit in meiner Bibliothek prüfen

Bestellung bei Subito €

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Dokumentinformationen

Titel:

Detection of junction failures and other defects in silicon and III-V devices using the LBIC technique in lateral configuration

Beteiligte:

Acciarri, M. (Autor:in) / Binetti, S. (Autor:in) / Garavaglia, M. (Autor:in) / Pizzini, S. (Autor:in) / Balkanski, M. / Kamimura, H. / Mahajan, S.

Erschienen in:

Solid-State Materials for Advanced Technology ; 208-212

MATERIALS SCIENCE AND ENGINEERING -LAUSANNE- B ; 42

Erscheinungsdatum:

01.01.1996

Format / Umfang:

5 pages

ISSN:

0921-5107

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.11

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