Detection of junction failures and other defects in silicon and III-V devices using the LBIC technique in lateral configuration: Fid-Bau Portal

Detection of junction failures and other defects in silicon and III-V devices using the LBIC technique in lateral configuration

Acciarri, M. / Binetti, S. / Garavaglia, M. / Pizzini, S.

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Detection of junction failures and other defects in silicon and III-V devices using the LBIC technique in lateral configuration

Acciarri, M. / Binetti, S. / Garavaglia, M. / Pizzini, S.

Detection of junction failures and other defects in silicon and III-V devices using the LBIC technique in lateral configuration

Acciarri, M. / Binetti, S. / Garavaglia, M. / Pizzini, S.

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Order at Subito €

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Document information

Title:

Detection of junction failures and other defects in silicon and III-V devices using the LBIC technique in lateral configuration

Contributors:

Acciarri, M. (author) / Binetti, S. (author) / Garavaglia, M. (author) / Pizzini, S. (author) / Balkanski, M. / Kamimura, H. / Mahajan, S.

Published in:

Solid-State Materials for Advanced Technology ; 208-212

MATERIALS SCIENCE AND ENGINEERING -LAUSANNE- B ; 42

Publication date:

1996-01-01

Size:

5 pages

ISSN:

0921-5107

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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