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Microstructural development in copper-interlayer transient liquid phase bonds between martensitic NiAl and NiTi
Microstructural development in copper-interlayer transient liquid phase bonds between martensitic NiAl and NiTi
Microstructural development in copper-interlayer transient liquid phase bonds between martensitic NiAl and NiTi
Gale, W. F. (Autor:in) / Guan, Y. (Autor:in)
JOURNAL OF MATERIALS SCIENCE ; 32 ; 357-364
01.01.1997
8 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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