Microstructural development in copper-interlayer transient liquid phase bonds between martensitic NiAl and NiTi: Fid-Bau Portal

Microstructural development in copper-interlayer transient liquid phase bonds between martensitic NiAl and NiTi

Gale, W. F. / Guan, Y.

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Microstructural development in copper-interlayer transient liquid phase bonds between martensitic NiAl and NiTi

Gale, W. F. / Guan, Y.

Microstructural development in copper-interlayer transient liquid phase bonds between martensitic NiAl and NiTi

Gale, W. F. / Guan, Y.

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Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Microstructural development in copper-interlayer transient liquid phase bonds between martensitic NiAl and NiTi

Contributors:

Gale, W. F. (author) / Guan, Y. (author)

Published in:

JOURNAL OF MATERIALS SCIENCE ; 32 ; 357-364

Publication date:

1997-01-01

Size:

8 pages

ISSN:

0022-2461

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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