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Measurement of thermal expansion coefficients by electronic speckle pattern interferometry at high temperature
Measurement of thermal expansion coefficients by electronic speckle pattern interferometry at high temperature
Measurement of thermal expansion coefficients by electronic speckle pattern interferometry at high temperature
Kim, K.-S. (Autor:in) / Kim, J.-H. (Autor:in) / Lee, J.-K. (Autor:in) / Jarng, S.-S. (Autor:in)
JOURNAL OF MATERIALS SCIENCE LETTERS ; 16 ; 1753-1756
01.01.1997
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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